Why choose oil-free compressor for semiconductor chip packaging test
Industry background
semiconductor chip packaging and testing is one of the most demanding aspects of environmental cleanliness in the field of electronic manufacturing, and its production environment must meet the ISO 14644-1 Class 5 clean room standard. Compressed air in this process is used to drive precision equipment, pneumatic control and purge packaging mold, any oil, particles or moisture residue may lead to chip microcircuit short circuit or package failure. According to the SEMI F49-0306 standard, the pollutant content of the compressed air system must be strictly controlled within the industry threshold, and the oil-free compressor has become the key equipment to ensure the chip yield by virtue of its zero oil pollution characteristics.
Technical Necessity
traditional oil-containing compressors cannot meet the stringent air purity requirements of semiconductor packaging tests due to the residual risk of lubricant atomization. Oil-free compressors completely eliminate the possibility of contact between lubricating oil and compressed air by using a fully enclosed screw design (structural integrity standards as defined by ISO 5389) and ceramic coating technology. At the same time, the output compressed air meets the double certification of ISO 8573-1 Class 0 (oil content ≤ 0.01 mg/m) and Class 1 (particulate matter ≤ 0.1 μm), and can be directly used in sensitive processes. In addition, the technology meets the requirements of the VDMA 15364 standard for the dryness of compressed air, and the dew point temperature can be stably controlled at -70°C (ISO 7183 test method), effectively preventing metal oxidation caused by moisture.
Key parameters
- pressure stability: Chip packaging equipment usually needs a constant pressure of 0.7-1.0MPa, and the fluctuation needs to be ≤ 1% (according to ISO 5389 dynamic performance test).
- Oil content: Must pass ISO 8573-1 Class 0 certification and meet the SEMI F49-0306 limit for VOCs (volatile organic compounds) ≤ 0.1ppm.
- dew point temperature: Using ISO 7183 standard dew point meter detection, need to reach -40 ℃ to -70 ℃ depth drying level.
- Energy efficiency grade: According to IEC 60034-30-1 standard, IE4 ultra-high efficiency level (energy efficiency ratio ≥ 95%) is required.
Comparison Table of Advantages and Disadvantages
| parameters | oil-free compressor | compressor with oil |
|---|---|---|
| oil residue risk | zero risk (ISO 8573-1 Class 0 certification) | requires three-stage filtration system (30% increase in maintenance costs) |
| dew point stability | ≤ ± 2 ℃ fluctuation (ISO 7183 test) | affected by the efficiency of the oil mist separator, the fluctuation can reach ± 5 ℃ |
| unit energy consumption | 0.10-0.12kW/m³(IEC 60034-30-1 Class IE4) | 0.15-0.18kW/m³(IEC 60034-30-1 Class IE2) |
| life cycle cost | maintenance interval ≥ 8000 hours (VDMA 15364 recommend value) | the filter element and lubricating oil shall be replaced every 2000 hours. |
Summary
in the field of semiconductor chip packaging and testing, oil-free compressors have become a necessary choice to improve product yield by eliminating oil pollution and ensuring air dryness. The oil-free compression technology developed by Shanghai Granklin Group conforms to international standards, and its parameter system strictly follows ISO 8573-1, IEC 60034-30 and other authoritative specifications, providing reliable power source support for chip manufacturing.